铅焊料用英语怎么说，铅焊料的英文翻译

词语导航

基本信息

词语：铅焊料

繁体：鉛焊料

拼音：qiān hàn liào

英语翻译

【机】 lead solder

相关词条

1.coarsesolder  2.leadsolder  

分词翻译

铅的英语翻译：

lead
【医】 molybd-; molybdo-; Pb; plumbi; plumbum

焊料的英语翻译：

solder
【电】 solder

翻译例句

1. 最后指出了无铅焊料的发展趋势。

At last, the progress trend of lead-free solder is pointed out.

2. 本产品不含铅，可适用无铅焊料。

The products do not contain lead and support lead free soldering.

3. 一般来说，相同的焊剂用于无铅焊料是有效的。

Generally the same fluxes will work for lead-free solder.

4. 文章以日本为例，介绍低温无铅焊料的技术课题与开发方向。

This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.

5. 因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。

So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.

6. 采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。

The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.

7. 氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。

Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.

8. 进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。WwW.wentIyi.Com

Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.

9. 这项研究的主要目标之一是建立一个通用的热机械为无铅焊料的耐久性模型。

One of the main objectives of this study is to develop a generic thermo-mechanical durability model for Pb-free solders.

10. 在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。

The solderability of electronic solders and some factors that influence the solderability are discussed.

11. 铅和无铅焊料的使用取决于敏捷的产品的具体文件提出的要求是可以接受的。

The use of both lead and lead free solder is acceptable depending on the requirements set forth in the product specific documentation available in Agile.

12. 文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。

The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.

13. 无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。

Structures and materials used in lead-free wave soldering equipments were different from traditional wave soldering equipments due to characteristic of lead-free solders and fluxes.

14. 随着无铅化电子组装需求的日益迫切，人们也越来越关注无铅焊料合金成分的专利问题。

With the increasing requirement of Lead-free electronics assembly, the patent problem on the alloy composition of Pb-free solders has also been greatly concerned.

15. 研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。

The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.

16. 概述了无铅焊料安装元件的可靠性评价和解析技术，以满足电子和汽车工业领域的顾客需要。

This paper describes the reliability evaluation and analysis technology of Pb-free solder mounting components, to meet customer"s need of electronics and automobile industries scale.

17. 在电子封装中焊料是主要的连接材料，现在无铅焊料已经普及并大规模应用在实际电子产品中。

Solders are the main join materials in the electronic - packaging and now lead-free solders are used in the electrical products on a large scale.

18. 该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。

The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.

19. 每个艺术花盆都是定制的。它们由手工制作的玻璃和无铅焊料接合而成，交付使用时，万事俱备，只欠花卉。

Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.

20. 笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；

Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.

21. 对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。

Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.

22. 对多种锡铅焊料进行一系列不同条件下的漫流性试验 ，分析它们在铜表面上的铺展状况 ，最后归纳出焊料成分、钎焊温度、助焊剂对软钎焊料漫流性影响的规律。

The results show that the melting properties of the solder alloy are satisfactory, and the soldering temperature and time have much effect on the shearing-strength of the joints.

23. 随后得出了不同焊料在此模型中的适用性及无铅工艺对焊点可靠度的部分影响。

Then which solder is best fit for this model and the influence on fatigue of solder are known, when free-lead solder is used.

24. 用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。

Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication.

25. 通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。

Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

26. 集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

27. 集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

28. 在电子电器领域，产品制造过程零配件之间连接导通工艺中的铅锡焊料所引起的环境污染越来越引起人们的重视。

In the electrical and electronic fields, Pb-Sn solder which is used to connect parts in the product manufacturing process can cause environmental pollution, which has drawn increasing attention.

29. 在电子电器领域，产品制造过程零配件之间连接导通工艺中的铅锡焊料所引起的环境污染越来越引起人们的重视。

In the electrical and electronic fields, Pb-Sn solder which is used to connect parts in the product manufacturing process can cause environmental pollution, which has drawn increasing attention.