词语导航
基本信息
词语：圆导体
繁体：圓導體
拼音：yuán dǎo tǐ
英语翻译
【电】 round conductor
分词翻译
圆的英语翻译：
circularity; cirlce; justify; round; roundness
【化】 circle
【医】 gyro-
导体的英语翻译：
conductor
【化】 conductor
【医】 conductor
翻译例句
1. 同时给出了几种不同导体电流密度及透入深度的计算结果 ，得出了半径较大的圆导体在考虑集肤效应时可当作平面导体来处理的结论 。
The paper gives the calculated results of current density and depth of penetration, from which we conclude that the conductor with larger r.
2. 半导体公司于2000年初期就开始从200mm晶圆转换到300mm技术。
ffAustin (TX) - Semiconductor companies began making the switch from 200mm to 300m wafers in the early 2000s. The push is now on toward 450mm by 2012.
3. 它提供了全面的半导体晶圆制造服务、技术供应商和系统公司。
It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.
4. 已经设计出专门的探头来测量半导体晶圆片和半导体棒的电阻率。
Special probes have been designed for making resistivity measurements on semiconductor wafers and bars.
5. 半导体晶片处理。单或双室，25晶圆批量处理提供高晶片清洁，冲洗和脱水功能。
Semiconductor wafer processing. Single or dual chamber, 25-wafer batch processing offers high-performance wafer cleaning, rinsing and drying.
6. 特许半导体制造有限公司(特许)是世界上最大的专用半导体晶圆代工厂，位于新加坡。
Chartered semiconductor Manufacturing Ltd (Chartered) is one of the world"s top dedicated semiconductor foundries in Singapore.
7. 同轴馈源是用于反射面天线双频共用馈源的一种重要形式，其内导体为工作在高频段的圆波导馈源，同轴区域为工作在低频段的同轴馈源。
The coaxial feed is an important dual-band feed used in reflector antennas. The inner conductor of the coaxial feed is the high frequency feed, and the coaxial zone is the low frequency feed.
8. 导体：一般采用相同或不同直径的圆单线绞合而成，本样本采用前者工艺。
Conductor: generally USES similar or not similar diameter twisted round single wire. This sample book adopts the former technology.wWW.WentiYI.coM
9. 半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
10. 针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
11. 本文介绍了半导体晶圆制造车间层控制的内容及方法。
Content and methods of shop-floor control in semiconductor wafer fabricati…
12. 针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
13. 集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
14. 硅晶圆大圆片上切割而成的一个小片半导体材料。
Die: a single piece of semiconductor material that has been cut from a slice by scribing and breaking.
15. 激光器件及激光束的动态调制，目标反射系数补偿：采用半导体激光器，经过整形、准直成圆细光束。
Dynamic modulation of laser and laser bean, and offset to target reflection coefficient: laser bean is shaped and collimated to round and slender beam by using of the semiconductor laser.
16. 主要介绍了半导体晶圆rca清洗工艺以及半导体晶圆自动清洗设备在生产中的结构设计和应用情况。
This article introduces the clean process of RCA for silicon wafer, and the design and apply in the manufacture of this kind of silicon wafer auto clean equipment.
17. 另一些对于晶圆片级半导体的弱电流测量则通常与介电材料(氧化物或化合物)的质量有关。
Other typical low current measurements on wafer level semiconductors are related to the dielectric, either the oxide or compound quality.
18. 因此，在半导体行业中，必须快速、准确地对硅晶圆片导电类型、方块电阻和电阻率进行判断、测量和分档。
Therefore, in the semiconductor industry, we must quickly and accurately type conductive film on silicon wafers, the square resistance and resistivity of judgement, measurement, and grading.
19. 一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
20. 通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
21. 采用本发明实施例的方法能够提高生产的半导体晶圆的稳定性和生产的效率。
By adopting the method of the embodiment of the invention, the stability and the production efficiency of the produced semiconductor wafer can be improved.
22. 作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
23. 作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
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